Custom Circuit Solutions – SMD to DIP Breakout PCB Module, 16-Pin, SOIC to DIP Adapter Header with Integrated SMT Resistor and/or Capacitor Pads – LF - 6 Pieces
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16-Pin SOIC LF
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0.30 kg
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Nuevo
Amazon
USA
- Custom Circuit Solution’s SMT to DIP solderable breadboard prototype modules are much more than a traditional SMT breakout PCB. They offer many benefits including flexible mounting options with dual rows of solderable holes, the ability to incorporate passive devices directly on board (such as 0603/0805 footprint passive components), as well as oversized pads to simplify hand soldering. By incorporating most or all of the circuit’s components directly onboard, you not only make the circuit reusable, it also becomes more reliable, and the signal quality is vastly improved with the minimized lead parasitics when compare to through hole passives plugged into a solderless breadboard. A localized ground/common plane underneath the SOIC-8 device is also included. This allows you to use SOIC-8 devices that require a bottom thermal pad connection, which can be soldered with a standard soldering iron, given the pad extensions beyond the end of the device. This specific module is for SOIC narrow components only. Wide body SOIC devices may be used but will require bending the pins underneath. Alternative sized versions are available if necessary. This SMD header can mount directly to standard breadboards or can be wire jumped directly to other circuits. These devices are beneficial for professional engineers and home hobbyists alike. Stock your makerspace lab with these today.
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Modular Component Breakout Boards such as these include both an SMD adapter (SOIC-16) and passive component pads in a single reusable SMD breakout board. Dual Rows of Solder Pin Holes provides much more flexibility in soldering and mounting your circuit. Jumper wires can also be soldered between holes, reducing number of breadboard connections. Oversized Solder Pads simplify hand soldering. Can be easily soldered without special equipment in as little as a few seconds. See our website for easy soldering tips. Integrated Local Common/Ground Plane allows the use of SOIC devices with thermal solder pads on the bottom. This SMT adapter can be used for high power converters with higher operating temps. 0603/0805 Footprint Pads between each pin and the local common plane (or pin to pin) allow for integrated onboard SMT res/cap connections, greatly reducing the number of wired connections.