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UL94-V0 Thermally Conductive Silicone Encapsulating and Potting Compound Heat-Resistant,High Thermal Conductivity,Seal,Mask,Waterproof & Insulate Electrical Circuits (192 0.8W/M.K Gray 300G)
Color:
192 0.8W/M.K Gray 300G
En stock
0.37 kg
Sí
Nuevo
Amazon
- Selectable Thermal Conductivity: The Ausbond compound offers excellent thermal conductivity, with options ranging from 0.8 W/M.K to 3.3 W/M.K, allowing customers to select the level of heat dissipation needed for their specific applications.
- UL94V0 Flame Retardant Certification: This Ausbond Flame-Retardant Thermally Conductive potting compound meets the stringent UL94V0 flame retardant standards, ensuring safety and compliance for electronics that require protection against fire hazards.
- Flexible Curing Options: The Ausbond High Thermal Conductivity Electronic Grade Potting Compound can be cured at room temperature or through heat curing, with the curing process accelerated by higher temperatures, making it suitable for various production environments.
- Intermediate Hardness: Once cured, the Ausbond Flame-Retardant Thermally Conductive Electronics Potting Glue is harder than standard silicone potting adhesives but softer than epoxy resin potting adhesives, providing a balance of protection and flexibility.
- Chemical Resistance: The cured material exhibits excellent resistance to acids and alkalis, safeguarding the encapsulated electronics from harsh chemical environments.Ausbond Flame-Retardant Thermally Conductive Electronic Potting And Encapsulation
- Waterproof and Insulating: The Ausbond High Thermal ConductivityElectronic Potting Compound provides waterproof sealing and insulation, making it ideal for applications where moisture protection and electrical isolation are necessary.
- Temperature Resistance: With excellent resistance to both high and low temperatures, ranging from -60℃ to 200℃, the compound is suitable for electronics used in extreme temperature environments.Ausbond Flame-Retardant Thermally Conductive Electrical Silicone Potting Compound
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