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BGA Reballing Repair Fixture BGA169, BBGA153 with Stainless Steel Construction for Soldering Stations, Accurate Locating Pillars and Heat Templates
En stock
0.35 kg
No
Nuevo
Amazon
- Fine Metal Locating Pillars: The BGA reballing repair fixture features accurate locating pillars on the base, ensuring accurate positioning and preventing the main board from shifting during operating. This design enhances stability and reliability for soldering tasks.
- 4 In 1 Design: The planting tin is specifically designed for BBGA153, for BGA169 Mbga MY3 chip IC soldering stations, providing a versatile solution for soldering tasks. It includes soldering templates and fixtures for various BGA chip sizes, making it a comprehensive repair and maintenance tool kit.
- Excellent Stainless Steel Material: Constructed from stainless steel, the BGA reballing offers durability and longevity for repeated use in soldering and repair tasks. The excellent material ensures stability and to erosion, maintaining the 's performance over time.
- Good Performance: The reballing BGA motherboard tool can be heated using a hot air gun, and the templates are to deformation during heating. This feature ensures consistent performance and reliability when working with delicate components.
- Multifunctional: With its accurate locating pillars, heat templates, and compatibility with various BGA chip sizes, the tin is a secure tool for soldering, reballing, and repair tasks. It provides a stable and secure for accurate soldering and maintenance of electronic components, making it an essential tool for electronics enthusiasts and professionals.
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Specification: Item Type: Planting Tin Material: Stainless Steel Application: for BBGA153, for BGA169 How to Use: Direct installation and use. PackageList: 1 x Base 1 x 4 in 1 Positioning Plate 1 x Soldering Net 2 x Solder Scrape Blades 8 x Adjustment Pieces