Artículo: AMZ-B0CF45TJ7B

Fafeicy

Reballing Stencil, Stainless Steel Phone CPU Reball Rework Template Screen for A60 to A90, Soldering Stations

Disponibilidad
En stock
Peso con empaque
0.20 kg
Devolución
No
Condición
Nuevo
Producto de
Amazon

Sobre este producto
  • for IC Chip: The IC slots on the main body can effectively prevent small IC tin from sticking and prevent small IC from breaking corners.
  • Quick in Tinning: Fast in tinning speed and accurate in positioning, the BGA reballing stencil is not likely to deform under high temperature.
  • Stainless Steel: The premium stainless steel material with standard design has a sturdy structure, which is very for long term using.
  • Simple Carrying: Compact in size and light in weight, the phone CPU rework stencil is very convenient to carry, and very simple to work on it.
  • Fitting: Allows for wide application on for SDM450, 660, SM6150, MT6762 CPU as well as for A60‑A90 series, A10S, A605F, A705F and more.
$17,30
44% OFF
$9,61

IMPORT EASILY

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$17,30
44% OFF
$9,61
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