Artículo: AMZ-B09TP4YD65

Amaoe Magnetic BGA Reballing Stencil Kits Set for NOTEBOOK 8th QQTG/SRGKW CPU IC Chip Solder Ball Tin Planting Template/Heating Direct Net Re-Balling Steel Mesh Repair Tools - 0.30mm

Disponibilidad
En stock
Peso con empaque
2.54 kg
Devolución
No
Condición
Nuevo
Producto de
Amazon

Sobre este producto
  • 100% original and top quality! All steel materials are made in Japan.
  • The BGA Reballing Stencil Kits Set can be heated by the hot air machine, these stencils are not easy to deform when heated.
  • Amaoe BGA Reballing Stencil Template is mainly used for NOTEBOOK 8th QQTG/SRGKW CPU IC Chip Solder Ball Tin Planting Net/Heating Direct Steel Mesh Welding Template Repair Tools.
  • APPLICATION: They are excellent molds for telephone repair shops.
$42,19
55% OFF
$19,18

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$42,19
55% OFF
$19,18

10% OFF en compras mayores a $100 con Tarjetas Banco Pichincha

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Llega en 16 a 26 días hábiles
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Este producto viaja de USA a tus manos en
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Amaoe Magnetic BGA Reballing Stencil Kits Set for NOTEBOOK 8th QQTG/SRGKW CPU IC Chip Solder Ball Tin Planting Template/Heating Direct Net Re-Balling Steel Mesh Repair Tools - 0.30mm Package Included: 1pc

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