SKU/Artículo: AMZ-B0BZMZ1CY9
Semiconductor Packaging 1: An Overview
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0.76 kg
0.76 kg
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Sí
Sí
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Nuevo
Nuevo
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Amazon
Amazon
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USA
USA
Sobre este producto
- "Diving into the intricate world of Semiconductor Packaging Technologies, this comprehensive book offers a thorough exploration of the foundational principles, evolving methodologies, and future prospects within the realm of electronic device integration. Authored by experts in the field, each chapter meticulously dissects the multifaceted facets of semiconductor packaging, from its historical origins to its contemporary applications across diverse industries. Beginning with an insightful overview of semiconductor packaging's significance in modern electronics, the book delves into the core objectives and functions that underpin its crucial role in device protection, performance enhancement, and system integration. Readers are guided through a journey that spans the spectrum of packaging technologies, including die attach techniques, encapsulation methods, interconnection technologies, and design considerations, providing a comprehensive understanding of the intricate processes involved in semiconductor packaging. From fundamental semiconductor materials and devices to advanced packaging types and their evolution, each topic is elucidated with clarity and precision, offering readers a robust foundation for delving deeper into the complexities of semiconductor packaging. Additionally, the book explores the pivotal role of packaging technologies in driving innovations in emerging fields such as 5G, IoT, and AI, while also addressing the challenges and opportunities that lie ahead in the ever-evolving landscape of electronic device integration. With its blend of historical insights, technical expertise, and forward-looking perspectives, this book serves as an invaluable resource for students, researchers, and industry professionals seeking to gain a comprehensive understanding of semiconductor packaging technologies and their transformative impact on the future of electronics. Whether as a reference guide or a comprehensive textbook, this book is sure to enlighten and inspire readers as they navigate the dynamic world of semiconductor packaging." SERIES DESCRIPTION: The series begins with an introduction to semiconductor packaging technologies and their evolution over time, followed by a review of the essential principles of semiconductor materials and devices. Readers will then delve into a wide range of topics, including wire bonding techniques, flip-chip packaging, surface mount technology, and advanced 2.5D and 3D integration methods. Special attention is given to the importance of thermal management, electrical performance, and signal integrity in modern semiconductor packaging designs. KEYWORDS:Semiconductor packaging technologiesElectronic device integrationChip-to-package interactionsDie attach techniquesEncapsulation methodsInterconnection technologiesSystem-in-package (SiP)Wafer-level packaging (WLP)Emerging semiconductor packaging trendsIoT and semiconductor packaging5G semiconductor packaging applicationsAdvanced packaging materials CONCEPTS:Unraveling the Origins: A Historical Journey of Semiconductor PackagingNavigating the Complexities: Objectives and Functions of Packaging TechnologiesFrom Silicon to Systems: Understanding Semiconductor Materials and DevicesBuilding Blocks: Die Attach Techniques and Encapsulation MethodsBridging the Gap: Interconnection Technologies in Semiconductor PackagingMiniaturization and Integration: Exploring Wafer-Level and Chip-Scale PackagingInnovations in Integration: System-in-Package and Multi-Chip ModulesDesigning for Reliability: Considerations in Semiconductor Package DesignFuture Horizons: Challenges and Opportunities in Packaging TechnologiesTransformative Applications: Semiconductor Packaging in 5G, IoT, and AI
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