SKU/Artículo: AMZ-9811999163
Chiplet Design and Heterogeneous Integration Packaging
Format:
Hardcover
Detalles del producto
Disponibilidad:
En stock
En stock
Peso con empaque:
1.24 kg
1.24 kg
Devolución:
No
No
Condición
Nuevo
Nuevo
Producto de:
Amazon
Amazon
Viaja desde
USA
USA
Sobre este producto
- The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
AR$472.619
44% OFF
AR$262.564
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AR$472.619
44% OFF
AR$262.564
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