RF and Microwave Microelectronics Packaging
Format:
Hardcover
En stock
0.59 kg
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Nuevo
Amazon
USA
- RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.
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Used Book in Good Condition