Artículo: AMZ-B09C1MC1F2

QINIZX

Adjustable Motherboard Backplate CPU Heatsink Mounting Bracket Kit Compatible with Intel LGA 775 1150 1155 1156 1366 Motherboard CPU Radiator Holder Backplate Snap Fix Screw Bolts

Detalles del producto
Disponibilidad
En stock
Peso con empaque
0.20 kg
Devolución
Condición
Nuevo
Producto de
Amazon
Viaja desde
USA

Sobre este producto
  • One Set kits contains 1pc adjustable backplane, 4pcs screw, 4pcs spring and 4pcs gasket. Note: This kits only compatible with INTEL original plastic buckle (the original box fan installed with the CPU). And the same type of screw spring radiator replacement. Compatible with Intel 775, lga 115X (1155, 1156, 1150, 1151), 1366, 2011 motherboard use, universal backplane, adjustable. Compatibility is very good. Three kinds of hole distance can be adjusted: 1. 775 hole pitch is 7.2cm 2. 1155, 1156, 1150, 1151 hole distance is 7.5cm 3. 1366, 2011 motherboard hole spacing is 8.0cm (note that not all 2011 motherboards can be used, the main difference is the 4 screw holes for fixing the heat sink.) (Note: Some Hp/Dell motherboards use very special high-instep backplanes. If they cannot be used, you can directly apply for return.)
$24,17
44% OFF
$13,43

IMPORT EASILY

By purchasing this product you can deduct VAT with your RUT number

$24,17
44% OFF
$13,43

3 meses de gracia en diferidos y hasta 6 meses sin intereses con Pacificard

Envío gratis
Llega en 5 a 12 días hábiles
Con envío
Tienes garantia de entrega
Este producto viaja de USA a tus manos en

Conoce más detalles

Note: This kits only compatible with INTEL original plastic buckle (the original box fan installed with the CPU). And the same type of screw spring radiator replacement. Compatible with Intel 775, lga 115X (1155, 1156, 1150, 1151), 1366, 2011 motherboard use, universal backplane, adjustable. Compatibility is very good. Motherboard backplate can adjuste the hole distance. 775 hole pitch is 7.2cm; 1155, 1156, 1150, 1151 hole distance is 7.5cm; 1366, 2011 motherboard hole spacing is 8.0cm (note that not all 2011 motherboards can be used, the main difference is the 4 screw holes for fixing the heat sink.) Note: Some HP/DELL motherboards use very special high-instep backplanes. If they cannot be used, you can directly apply for return. Material: Plastic+Iron. One Set kits contains an adjustable backplane, 4pcs screw, 4pcs spring and 4pcs gasket.